erm...big CPU installation problem!
- Thread starter Mattyl110792
- Start date
I agree with thermal paste. Artic Silver 5 is the paste of choice.lhuser said:
However the temps sound more like he didn't remove the protective tape off the thermal pad before installing the heatsink.
If you didn't, it's too late now. Remove the heatsink and clean it real good. Apply a dot of AS5 on the cpu and spread it to cover the entire surface. Reinstall the heatsink and let the system idle for a while before you put the spurs to her.
...Mattyl110792
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Thanks for the answers....first off...is thermal paste fairly ewasy to come across, and secondly, running at 40c, it wouldnt be damaging it, so can i use it until i get thermal paste?
Matt
Matt
40C is within the temp zone for C2D, it is not excessively hot, these chips run warmish, it will not hurt the cpu.
The 82C result you got was from incorrect contact between the cpu and heatsink as you found out by "fiddling" with it. The part that concerns me is you state the pad looks alright, implying you have removed and replaced the heatsink without reapplying the thermal compound. Not good.
You'll be alright at those temps if they continue at that level when the cpu is under load (But I doubt this will be the case)
You should, as already stated, replace the compound with (preferably, AS5.) though any other 99.9% silver thermal compound will work just as well.
Be sure to check out the new instructions regarding AS5 (and other compounds) with regard to dual core chips, the "grain of rice blob" method is not recommended for dual cores, instead a "thin line" is now the go (see link)
LINK
The 82C result you got was from incorrect contact between the cpu and heatsink as you found out by "fiddling" with it. The part that concerns me is you state the pad looks alright, implying you have removed and replaced the heatsink without reapplying the thermal compound. Not good.
You'll be alright at those temps if they continue at that level when the cpu is under load (But I doubt this will be the case)
You should, as already stated, replace the compound with (preferably, AS5.) though any other 99.9% silver thermal compound will work just as well.
Be sure to check out the new instructions regarding AS5 (and other compounds) with regard to dual core chips, the "grain of rice blob" method is not recommended for dual cores, instead a "thin line" is now the go (see link)
LINK
