ONE more... PAD or CERAMIQUE?

[regeisle]

The system I'm building is below, in it's basics...

- P4 2.8 Northwood 800 FSB
- Intel D865PERL Mobo
- 1 GB Kingston DDR400

I'm using the stock HS/FAN for the P4. As you all know, it has a thermal pad. I'm not planning on overclocking (if at all, maybe to 2.9 or so, since the intel board is pretty strict). SO... should the pad cover all of my cooling needs? I bought Arctic Silver Ceramique just in case. I'll have 4 case fans - 1 front, 2 rear and 1 over the AGP slot (side panel of case). I'd rather make the decision now, and not have to go in and scrape all the pads melted wax off the thing ina few months. But if the pad will do the job fine, I won't bother with taking it off.

Thanks again!

 

[mrzeeedler]

Take off thermal pad and apply artic silver. Drastically changes the cooling> btw you cant overclock intel mobos atl all

 

[regeisle]

Thanks mrzeedler. I'll go for the compound. I know, I'm not planning on OC'ing. The 2.8 should keep me happy, and it's a comp for my graphic design business, so I want to make it as stable as possible - so no OCing.