Originally Posted by peterhuang913
I'd rather smudder my HSF with paste, leaving a 1mm thick layer of thermal paste.
Why? Thermal paste's thermal properties are much worse than aluminum, copper, etc.. It's much better than air, so that's why it's used, to fill the gap between the heatsink and the CPU.
So what exactly is wrong with lapping to you guys..? Is it the fact that you've never done it before?
A thick layer of thermal paste is bad, too.
And you don't have to lap your CPU, your heatsink alone is fine. Obviously you get better results with your CPU lapped correctly, but whatever.