Originally posted by NeedAcpu
Yes you might do this, but spreading it out is not the recommended way for a reason. Putting a dab in the middle gives you the lowest temperatures and is why its recommended. It's been proven that spreading the paste does nothing because the actual cpu die is very small and in the middle of the plate that covers the cpu.
ok. so put a small dot, in the center of the IHS. Then fasten the heatsink down tightly.
DO YOU THINK THE FREAKIN' THERMAL PASTE IS STILL JUST IN THE CENTER OF THE IHS? NO IT'S NOT! IT'S SPREAD OUT FROM THE PRESSURE OF THE HEATSINK MOUNTED TO THE SOCKET. AND PROBABLY UNEVENLY.
You people still don't seem to understand. Look at the IHS and look at the HS. The two surfaces are nearly the same size. Those two surfaces are in constant contact to the human eye. But, at a microscopic level, they are not. The thernal paste is used to help increase the connected surfaces of both those dissipation materials.
Questions: Is it better to disspate heat over a larger area or smaller area? Which would be faster and slower? Why are they designing heat sinks to be larger and larger these days? exp. Zalman 9500.
Why is the bottom surface of the heat sink the same size as the IHS of a cpu? Why does a major heatsink manufacturer like Zalman have installation videos that show, "Spreading the thermal Paste evenly" out over the CPU."?
A LARGER SURFACE AREA HELPS MOVE MORE HEAT AWAY, FASTER.
THAT IS WHY YOU WANT THE WHOLE SURFACE OF THE IHS EVENLY and THINLY COVERED WITH THERMAL PASTE. A COMPLETE SURFACE BOND.
If you want the best cooling solution, remove the IHS completely and mount the heat sink directly to the "CPU DIE"
give me some links of proof that your "dot" in the middle theory actually produces lower temps.