Originally posted by 003
Paste is better, and AS5 happens to be the best. However you should not have spread it around. You should not have even touched it.
The way you apply AS5 is you put a dab about the size of a grain of rice in the center of the CPU and then put the HSF on top of it. Once you put the HSF on do not let it break the seal with the AS5 or you have to redo it.
I don't completely agree with this statement.
I've always used a pea sized drop of AS5, then used a credit card to "mason" a very thin layer across the top of the IHS. I spread it very thin so it's about the thickness of a piece of paper.
Then I carefully install the HS and do
follow your rule of not breaking the seal.
Thermal Paste is not as technically as everyone makes it out to be.
It's simply used to fill "air gaps & surface inperfections" between the IHS and HS, to increase dissipation.
Of course too much is not good and not enough is not good. Put normally anywhere between and grain of cooked rice and a pea, is usually fine.
As long as the paste makes a tight thin seal, it's fine.