shoot me for being pedantic but havoc seems to be the only person who has actually done any research into or built an MP system seeing as he chose an appropriately achievable configuration, where all the people who keep saying they are going to use multiple kentsfield's are smoking crack because as far as i know they have no MP support i.e. single processor system use only.
since AMD's K7 and Intel's P4 (not to be confused with "P5" Prescott and up) server parts have had their own package and socket.
on another note though it's interesting to see that Intel did go with the predicted foolish idea of two dies on the PCB, cutting corners like with the Pentium D's. though they get credit for at least having two cores to each die. if the schematic image at the top of the article is accurate i think the heat issue could be worsened by the positioning of the dice (wonder if that's the correct plural form
) and the cores in the dice would distribute heat very unevenly. i don't presume to know better than their engineers but i would have wanted to keep the four cores centralised. not that it would make a huge difference but if my thinking is correct and it would help.....well they should do everything they can that would be a "good" design.