Great and easy improvement on IBM's part. I can definitely see them implementing this in the near future.
"IBM's find addresses how thermal paste is typically spread between the face of a chip and the heat spreader that sits directly over the core. Overclockers already know how crucial it is to apply thermal paste the right way: too much, and it causes heat buildup. Too little, and it causes heat buildup. It has to be "just right," which is why IBM looked to find the best way to get the gooey stuff where it needs to be and in the right amount, and to make it significantly more efficient in the process"
IBM doubles CPU cooling capabilities with simple manufacturing change