the thinner the layer of the thermal interface, optimum will be your cooling, just keep in mind in that way, that the thermal pads/pastes are use to fill the micro gaps on the surface of the CPU and Heatsink to avoid air getting trapped inside these gaps. as Air is bad conductor of heat, therefore no need to apply thick layer on the surfaces thinking more the thermal paste, more will be heat dissapation. a half size grain of boiled rice's amount of paste will be sufficent to cover the P-4 DIE.
Intel Core2Quad 2.66Ghz 12MB L2-Cache
4096MB DDR Kingston Hyper-X
XFX 9600GT AlphaDog
Seagate 2 X 320GB SATA2
LG L246WH Flatron 24"