AMD Adds New Levels of Processing Performance to Embedded BGA Client Platform
AMD today announced immediate availability of two new dual-core, 18W TDP processors for the highly-scalable ASB1 BGA embedded client platform. The AMD Turionâ„¢ Neo X2 processor Model L625 and the AMD Athlonâ„¢ Neo X2 processor Model L325 deliver PC-caliber performance in a very low power envelope and with an embedded-friendly ball grid array (BGA) package. This embedded client solution is ideal for traditional embedded applications such as single board computing and thin client systems, as well as markets for self-service kiosks, point of sale machines and digital signage. The ball grid array (BGA) package helps alleviate potential reliability issues for systems that are deployed in rugged environments and has a low z-height that is designed to enable thin, compact enclosures.
