Thanks for all your help!
I was able to pop the processor off the heatsink much easier than I thought. As soon as I slightly pushed on the adhesive, the processor just popped right off.
To answer Alvin's question, I don't know how to tell what's been used between the processor and the heatsink. If I had to guess, I would say a thermal pad was used only because there is a cross-hatch pattern which would appear to be from some type of pad.
Now that I have re-installed the same processor and heatsink, should I re-apply some type of adhesive? Or will the processor heat up and reseal itself to the heatsink using the old adhesive/pad?
I know these may sound like dumb questions, but this is my first time dealing with motherboards and processors.
I really appreciate the responses to my post.
Thanks,
Jay