Dude just use a logic circuit for what you want, make your life easy.
As for the CO2 thing thats a bad idea if you ask me. The injection of CO2 would cause a very rapid temp change, metals and silicon are suseptable to excessive wear when exposed to rapid temp changes. You may end up causing alot of damage to your kit doing that. Furthermore the reason why decompressing gas is cold is purley because its decompressing, this adds inherent instability into the system - ie you cannot model the temp change well. Also thinking about it there would be a tempurate gradient across the heatsink since the gas would begin warming up instanly, especially since it will be put in a hot environment. This temp gradient may cause the metal to warp and this would put pressure on some areas of the CPU and remove good contact in others. This wouldn't be a good thing.
Still if your willing to risk it, it would be cool to find out how effective it was and how much of an effect the dangers outlined had and what the products life expectancy was during this process.
As for the CO2 thing thats a bad idea if you ask me. The injection of CO2 would cause a very rapid temp change, metals and silicon are suseptable to excessive wear when exposed to rapid temp changes. You may end up causing alot of damage to your kit doing that. Furthermore the reason why decompressing gas is cold is purley because its decompressing, this adds inherent instability into the system - ie you cannot model the temp change well. Also thinking about it there would be a tempurate gradient across the heatsink since the gas would begin warming up instanly, especially since it will be put in a hot environment. This temp gradient may cause the metal to warp and this would put pressure on some areas of the CPU and remove good contact in others. This wouldn't be a good thing.
Still if your willing to risk it, it would be cool to find out how effective it was and how much of an effect the dangers outlined had and what the products life expectancy was during this process.
