heatsink lapping is smoothing the surface that is in contact with the cpu. no air pockets, no matter how minute, means more efficient heat dissipation.
Yeah i saw MoM's thread on how to OC and Slaymate just comes in and in one post he OC's it to 4.0 GHz from 2.8 GHz all stable and stuff, I was like :O, pretty epic
Yeah i saw MoM's thread on how to OC and Slaymate just comes in and in one post he OC's it to 4.0 GHz from 2.8 GHz all stable and stuff, I was like :O, pretty epic
I have almost the exact same setup as you are even the MoBo. I am using a CoolerMaster TX3 CompUSA.com | RR-910-HTX3-G1 | Cooler Master Hyper TX3 CPU Cooler and it works great. Some of the guys on here have been helping me setup everything so it stays cool. I also just upgraded to a Thermaltake Case with 6 fans so everything is cool. I am working with SlayMate to figure out where some of the settings that they used to get 4.0GHz out of his are on the BioStar TH55B BiOS. I am looking forward to making my i5-760 fly.
Well I have the heatsink and the fan clips. I can't find the original retention bracket but I know I have a replacement Thermalright LGA 1156/1155 retention bracket at my office. If I don't find it tomorrow I order a new retention bracket for it.